Calculation Results
Standard
mil
mm
IPC-2152 Univ.
IPC-2221 Outer
IPC-2221 Inner
Design Parameters
A
°C
mil
in.²
mil

Actual PCB current capability is affected by many factors, including material lot variations, copper roughness, stack-up, via and pad heat-sinking, forced-air or natural convection, adjacent heat sources, and manufacturing tolerances.

This tool cannot account for every variable; calculated results may deviate significantly from real measurements. Always verify compliance with product safety standards and industry requirements, and make final decisions based on your specific needs.

Compared to IPC-2221, IPC-2152 incorporates additional factors influencing PCB current capacity. I personally prefer IPC-2152. Annex A.4.4 notes that, in still air, inner-layer traces can outperform outer-layer traces in heat dissipation because the thermal conductivity of FR-4 is much higher than that of air. This explains why IPC-2221’s inner-layer calculations differ greatly from those of IPC-2152.