Via Current Rating
Standard
A
IPC-2152 Univ.
IPC-2221 Through
IPC-2221 Blind/Buried
Design Parameters
°C

PCB via wall thickness and hole diameter cross-section

This PCB via current calculator is based on the published formulas and experimental data from IPC-2221 and IPC-2152. It is intended for quick, early-stage estimation of a via’s current-carrying capacity based on its diameter and allowed temperature rise.

The actual ampacity of a PCB via can be affected by material batch variations, copper roughness, stack-up, pad heat sinking, airflow (forced or natural), adjacent heat sources, manufacturing tolerances, and other factors.

The tool does not account for every variable; calculated values may differ significantly from measured results. Always verify compliance with your product’s safety standards and industry norms before finalizing the design.

Vias directly connected to a copper plane are estimated to carry ~1.2× the current of an isolated via.
IPC-2221 results: through-hole vias use the outer-layer formula; blind or buried vias use the inner-layer formula.

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