PCB Via Size Calculator | IPC-2221 & IPC-2152 Compliant

PCB via wall thickness and hole diameter cross-section

This PCB via calculator is based on the published formulas and experimental data from IPC-2221 and IPC-2152. It is intended for quick, early-stage sizing of vias given current and temperature-rise requirements.

Actual via ampacity can be affected by batch-to-batch material variation, copper roughness, stack-up, pad heat sinking, forced or natural convection, nearby heat sources, manufacturing tolerances, and more.

The tool does not cover every variable; calculated values may deviate significantly from measurements. Always verify compliance with your product’s safety standards and industry norms before finalizing your design.

Vias tied directly to a copper plane are estimated to carry ~1.2× the current of an isolated via.
IPC-2221 results: through-hole vias use the outer-layer formula; blind or buried vias use the inner-layer formula.

Via plating is typically 18–25 µm and often differs from outer-layer copper thickness. Always use the value provided by your PCB fabricator. Click to learn more.